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《舊聞複習》【通孔印錫膏（PIH，Paste-In-Hole）】製程就是把錫膏(Solder paste)直接印刷於PCB(Print Circuit Board，電路板)的電鍍通孔(PTH, Plating Through Hole)上面，然後再把傳統插件/通孔元件（DIP, Dual In Line Package / THT, Through-Hole Technology）直接插入到已經印有錫膏的電鍍通孔中，這時電鍍通孔上的錫膏會有部分沾粘在插件零件的焊腳上，但大部分還是保留在PCB上，這些沾黏在焊腳以及PCB焊墊上的錫膏在經過回焊爐高溫加熱時會重新熔融，進而將零件焊接於電路板上，可以取代波峰焊接(Wave Soldering)或手焊(Hand Soldering)製程。
《舊文複習》【PIH（Past-In-Hole，通孔印錫膏】製程就是把錫膏(Solder paste)直接印刷於PCB(Print Circuit Board，電路板)的電鍍通孔(PTH, Plating Through Hole)上面，然後再把傳統插件/通孔元件(DIP insert parts)直接插入到已經印有錫膏的電鍍通孔中，這時電鍍通孔上的錫膏大部分會沾粘在插件零件的焊腳上，這些沾黏在焊腳以及PCB焊墊上的錫膏在經過回焊爐高溫時會重新熔融，進而將零件焊接於電路板上，可以取代波峰焊接或手焊製程。
Today, most of electronic parts are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required stencil thickness becomes thinner from 0.18mm to 0.10mm. Some parts, however, cannot be downsized unlimitedly, such as external connectors. For example, a line socket of telephone, a network line socket, a smart card reader, and other devices require a certain amount of solder volume to ensure the soldering strength and quality. In addition, some traditional insertion parts (Dual in line package process, DIP) with paste-in-hole process require extra solder volume as well.
