【半導體年度盛會 SEMICON Taiwan - 產業最熱門話題一手掌握！】
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5G、AI 為產業注入新動能與挑戰☝️
而材料的創新，是半導體技術不斷演進的重要關鍵。
今年應材依舊最強陣容，全盤解析半導體最新封裝趨勢、3D技術應用於摩爾微縮挑戰、科技女力探討等多元議題！
快拿出你的行事曆，記錄下每一場精彩場次🤩
同步應材半導體材料工程技術專業見解：
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▋ 2020 系統級封測國際高峰論壇
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📆 9/22 08:30 - 17:20
《 Innovative Advanced Packaging Technologies Enable Emerging Device Applications 》
⦸ Albert Lan＿Global Sr. Packaging TD, Applied Materials
https://lihi1.cc/lD3IN
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📆 9/22 14:50 – 15:15
《 PVD Solutions for Panel Level Fan Out and EMI Shielding 》
⦸ Ravi Mullapudi＿Managing Director, Packaging BU, Applied Materials
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📆 9/24 11:10 – 11:45
《 Process and Equipment Requirements of Advanced Heterogeneous Packaging for Next AI/ Big Data Era 》
⦸ Guan Chen＿Packaging Sales Account GM, Applied Materials
https://lihi1.cc/HR0FH
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▋ 科技女力論壇
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📆 9/25 10:20 – 12:00《 Empowering Women for the Future》
⦸ Vicky Hsu＿Senior Director, Applied Materials Taiwan
https://lihi1.cc/yFRY3
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▋ 化合物半導體創新應用館
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📆 9/23 11:20-11:40、9/25 11:20-11:40
《 Opportunities and Challenges in High-Volume Production of Wide-Bandgap Power Technologies 》
⦸ Dustin Ho＿Technical Director, Applied Materials
https://lihi1.cc/kn8ZY
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#SEMICONTaiwan
applied materials advanced packaging 在 Applied Materials Southeast Asia 的推薦與評價
Advanced packaging has become a top priority for top chipmakers globally… Applied, ten years back, had the foresight to see the advanced packaging as a... ... <看更多>